Manhattan CPU Thermal Grease

• Thermal conductivity: >0.965 W/M-K
• Thermal impedance: <0.255 °C-IN2/W
• Specific gravity: >2.3
• Evaporation: <0.001%
• Bleed: <0.05%
• Dielectric constant A: >5.1
• Thixotropic index: 380 ±10 1/10 mm
• Operating temperature: -30 ~ 180° C
Physical
• Syringe dispenser with resealable cap
• 1.5 g (0.05 oz.)
Composition
• Silicone compounds 50%
• Carbon compounds 20%
• Metal oxide compounds 30%

Helps a processor keep its cool.

Manhattan CPU Thermal Grease helps create maximum surface-to-surface conductivity between a microprocessor and the CPU cooler heat sink to reduce overheating risks. Specially formulated to reliably and easily fill manufacturing imperfections in the wafer and heat sink surfaces Manhattan CPU Thermal Grease closes critical gaps that can reduce cooling effectiveness and increase possible failure.